Resin Systems and Versatic™ Monomers for Adhesives

Our epoxy and phenolic systems offer a wide range of processing and performance characteristics for formulating adhesives that bond metals, concrete, ceramics, glass, plastics, cloth, paper, polyesters or thermoplastic rubber. Our epoxy resin/modifier/curing-agent systems are available in high solids, waterborne and solvent-borne formats and with the following features:

Excellent chemical resistance
Excellent water resistance
Excellent performance at extremes of temperature
Rapid- and low-temperature cure
Strong bonding to many substrates

Our phenolic resins are suited for a wide range of reactive adhesives including metal adhesives, metal primers for bonding rubber, nitrile rubber adhesives, and contact, pressure-sensitive and hot-melt adhesives.

Hexion also offers a range of VeoVa™ vinyl ester monomers at different Tg levels allowing formulators to design adhesives to meet their specific needs.

Aerospace

We provide proven, technologically advanced solutions for aerospace bonding.

Automotive

High performance systems enable adhesive applications such as rubber-to-metal, screw fastening, hem flanges and adhesion promotion in PVC plastisols.

Chemical Anchoring

Our epoxy or vinyl ester resin-based systems for adhesives that bond metal to a solid substrate can deliver cured systems stronger than the substrate.

Composites and Electronics

These highly specialized systems for composite-to-composite bonding and electronics assembly (e.g. chip adhesives) are easily applied and durable.

Construction and Infrastructure

Hexion offers resins for adhesives bonding concrete to concrete, metal or other substrates as well as monomers that enhance alkali resistance.

Do-it-Yourself

These cost-efficient, robust two-component systems bond many substrates and deliver variable pot lives and curing times.