EPON™ Resin 2005

Description

EPON™ Resin 2005 is a fusion derived solid bisphenol A/epichlorohydrin epoxy resin designed for both thick film functional and intermediate film thickness decorative powder coatings. This product which is slightly higher in molecular weight than EPON Resin 2004, is recommended for use in pipe coatings, electrical insulation, rebar coatings and in decorative finishes that must be tough and durable.

Benefits

• Uniform quality from lot to lot
• Very stable under normal
• Multiple filtration to remove storage conditions particulate contaminants
• Provides consistent cure response
• Extremely low color with a wide variety of curing agents
• Low in moisture and total
• Extremely narrow property range volatiles content

Sales Specification

Typical Properties

¹ Grams of resin containing one gram-equivalent of epoxide. ASTM D 1652
² Determined on a 40% by weight resin solution in MEK. ASTM D 445 (Kinematic Viscosity at 25 °C).
³ Determined on a 40% by weight resin solution in MEK. ASTM D 1209 (Test for Platinum-Cobalt Color)
⁴ BrookfieldThermosel Method. ASTM D 2196 (Brookfield Viscometer - Thermosel, about 10 grams)
⁵ ASTM D 3461, Mettler, 1 °C/minute.
⁶ Density of Powder Coating Materials, The Powder Coating Institute. Recommended Procedure #4.
⁷ ASTM D 1726 (Hydrolyzable Chloride Content of Liquid Epoxy Resins)
⁸ At time of manufacture.
⁹ Determined by Differential Scanning Calorimetry (DSC).