EPI-REZ™ Resin 3540-WY-55

Description

EPI-REZ™ 3540-WY-55 Resin is a 55 percent solids dispersion of an EPON™ Resin 1007F in water and 2-propoxyethanol. This resin is designed for use in formulating industrial baking finishes, film adhesives/primers and fiber finishes/binders. When crosslinked with an appropriate resole, melamine or urea-formaldehyde resin and baked, epoxy coatings can be obtained that offer performance comparing favorably to solvent-borne epoxy coatings. This resin may also be used in industrial ambient cure primers in conjunction with waterborne EPIKURE™ amine curing agents that offer quick coalescing films with short lacquer dry times. 

Benefits

• May be formulated to low VOC coatings
• Good adhesion to steel or aluminum
• Compatible with a variety of aminoplast resins
• Stable with a wide range of solvents
• Nonionic stable dispersion of high molecular weight Bisphenol A resin

Sales Specification

Typical Properties