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EPI-REZ™ 3540-WY-55 Resin is a 55 percent solids dispersion of an EPON™ Resin 1007F in water and 2-propoxyethanol. This resin is designed for use in formulating industrial baking finishes, film adhesives/primers and fiber finishes/binders. When crosslinked with an appropriate resole, melamine or urea-formaldehyde resin and baked, epoxy coatings can be obtained that offer performance comparing favorably to solvent-borne epoxy coatings. This resin may also be used in industrial ambient cure primers in conjunction with waterborne EPIKURE™ amine curing agents that offer quick coalescing films with short lacquer dry times.
Property | Standard | Value | Unit | Test Method |
---|---|---|---|---|
Particle Size | 0.35 - 0.85 | microns | SRC 00033 | |
pH | 7 - 10 | ASTM E70 | ||
Solids | 53.5 - 55.5 | % | ASTM D1259 | |
Viscosity | 7000 - 17000 | cP | ASTM D-2196 | |
Weight per Epoxide | 1600 - 2000 | g/eq | ASTM D1652 |
Property | Standard | Value | Unit | Test Method |
---|---|---|---|---|
Appearance | Opaque white liquid | |||
Pounds/Gallon Solution | 9 | lbs/gal | ||
Pounds/Gallon Solids | 10.1 | lbs/gal |